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Northwestern University
NUFAB
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New Users
New Users Overview
Policy and Rates
Publication Acknowledgements
Equipment
Equipment Overview
Characterization Instruments
Cook Cleanroom Instruments
Deposition Instruments
Dry Etching - Ashing Instruments
E-Beam Lithography Instruments
Furnace Instruments
Packaging
Photolithography
Rapid Prototyping Instruments
Wet Processing Instruments
Outreach
News and Events
About
About Overview
Team
Advisory Committee
Packaging
Home
Equipment
Packaging
Characterization Instruments
Cook Cleanroom Instruments
Deposition Instruments
Dry Etching - Ashing Instruments
E-Beam Lithography Instruments
Furnace Instruments
Packaging
Photolithography
Rapid Prototyping Instruments
Wet Processing Instruments
Ball Wire Bonder - iBond5000
Wire Bonder – West Bond 747677E
Automatic Wire Bonder - TPT HB100 (Cook)
Wafer Dicing System – ADT 7122 (Cook)
Wire Bonder-Wedge (Cook)
New Users
New Users Overview
Policy and Rates
Publication Acknowledgements
Equipment
Equipment Overview
Characterization Instruments
Cook Cleanroom Instruments
Deposition Instruments
Dry Etching - Ashing Instruments
E-Beam Lithography Instruments
Furnace Instruments
Packaging
Photolithography
Rapid Prototyping Instruments
Wet Processing Instruments
Outreach
News and Events
About
About Overview
Team
Team Overview
Nasir Basit, PhD
Serkan Butun, PhD
Anil Dhote, PhD
Ying Jia, PhD
Shaoning Lu, PhD
Diego Santiago De La Vega
Advisory Committee
