Automatic Wire Bonder - TPT HB100

Instrument Details

Features

• The TPT HB100 Automatic Wire Bonder is ideal for specialized applications including bonding for quantum devices & devices with many repeatable bonds
• Capable of wedge, ball, ribbon, & bump bonding using Al or Au wire
• Heater stage for Au ball bonding (up to 100^oC)
• Motorized X, Y, & Z Axis for fluid movement
• Ultrasonic scrubbing @ 63 kHz for optimal metal-to-metal coupling

NUcore RESERVATION

Facility Contact

Main Contact: Anil Dhote, PhD
Office: Cook Hall, #4087
847-491-5959 / email

Alternate Contact: Diego Santiago De La Vega
Office: Technological Institute, #FG71
(847) 467-2015 / email

Location