Instrument Details
Features
- Maximum substrate size: 12” x 9”
- Minimum substrate size: 5 mm x 5 mm
- Substrate thickness: 0.02 to 7 mm
- Cut depth: Up to 1.5 mm
- Beam diameter 15 um
- Minimum cut width 20 um
- Camera system for substrate inspection, alignment, and basic measurement functions
- Conversion software for DXF, Gerber files
- Picosecond Laser Module (515 nm), 1 ps pulse duration, max 500 kHz pulse frequency, max 8 W power
