Instrument Details
Features
- Wafer size: 100 mm
- Bosch Process License
- Pegasus Source with 3kW RF Generator
- Gases: C4F8, SF6, O2, and Ar
- Processes: Smooth Sidewall (roughness<50 nm), Small Trench (2-3 micron), and Fast Etch Rate (>15 micron/min)
Deep Reactive Ion Etcher (DRIE) – STS LpX Pegasus
