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Plasma Enhanced Chemical Vapor Deposition (PECVD) – STS LpX CVD

Instrument Details

Features

  • Wafer size: 100 mm
  • Configured for SiO2, Si3N4, and a-Si deposition
  • Vacuum Loadlock
  • Gases: N2, Ar, He, N2O, 2%SiH4/N2, NH3, C4F8

Plasma Enhanced Chemical Vapor Deposition (PECVD) – STS LpX CVD  photo

NUcore RESERVATION

Facility Contact

Main Contact: Shaoning Lu, PhD
Office: Tech, #FG71
(847) 491-3853 / email

Alternate Contact: Dr. Nasir Basit
(847) 467-6201 / email


Location

Technological Institute FG70